Interpretation of SAIC SMTC 3 800 006 (V6) Electromagnetic Compatibility Test Specifications for Electronic and Electrical Parts Systems_Century Wisdom (Suzhou) Testing Technology Co., Ltd

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Interpretation of SAIC SMTC 3 800 006 (V6) Electromagnetic Compatibility Test Specifications for Electronic and Electrical Parts Systems

Release time:

2022-12-09 00:00

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　　Summary

　　The electromagnetic compatibility (EMC) requirements and test methods of automotive electronic and electrical components/systems stipulated in SMTC 3 800 006 (V6) EMC test specification for electronic and electrical components and systems are introduced.

　　Key words

　　Electromagnetic compatibility; half point wave anechoic chamber, shielded room, electromagnetic environment, radiation emission, conduction emission, magnetic field emission, harmonic emission, transient conduction emission, voltage fluctuation and flicker, radiation anti-interference, radio frequency anti-interference-large current injection method (BCI ), magnetic field anti-interference, coupling/inductive conduction anti-interference, transient conduction anti-interference, electrostatic discharge, electric fast burst, surge.

　　1 Introduction

　　SMTC 3 800 006 (V6) was released on 2020-09-29 and implemented on 2020-09-30. This standard specifies the electromagnetic compatibility (EMC) requirements and test methods for automotive electronic and electrical components/systems developed and produced by SMTC. Applicable to all automotive electronic and electrical devices, assemblies, components and parts.

　　2 General test requirements

　　All systems and equipment used in testing must be calibrated by ISO/IEC 17025 (or SMTC designated) metrology audits or national laboratories with corresponding accreditation qualifications, and must be traceable.

　　2.1 Test environment conditions

　　Unless otherwise stated, the test environment conditions specified in Table 1 shall be complied with.

temperature

(23±5)°C

Relative humidity

(Electrostatic discharge test)

20%~80%

(20%~40%)

　　Table 1 Test environment conditions

　　2.2 Test load

　　If there is no special instruction, the tested sample shall be tested with the actual electrical load, otherwise, the equivalent simulated load shall be used for the test. Among them, the disturbance test is recommended to cover the maximum load disturbance condition, and ensure that the load itself will not affect the test results. The reference test setup is shown in Figure 1.

　　2.3 Test power supply

　　Unless otherwise specified, the low-voltage power supply voltage should be between 13V (+1.0V/-1.0V), and the high-voltage power supply voltage should be between 60V and 1000V. For some parts that are powered by a power supply less than 12V (such as 5V), an external programmable power supply or a battery can be used to step down the power supply.

　　2.4 Test Harness

　　Unless otherwise specified in this standard, the length of the tested wire harness shall be 1700 mm (+300/-0 mm), the length of the load wire harness shall not exceed 2200 mm, and the length of the wire harness shall be calculated from the connector.

　　Figure 1 Reference Test Arrangement

illustrate:
1 - power supply	4——Insulation bracket (ε ≤ 1.4)
2 - Artificial Network	5——The sample to be tested
3 - load (optional)	6 - Ground plane
3a——The sample load under test (reference power supply)	7 - Optical fiber
3b——The load of the sample under test (reference ground)	8—— Optical fiber interface
3c——Optical fiber interface (optional, can be set outside the test load)	9—— Auxiliary/monitoring equipment

　　2.5 Classification of Functional Importance

　　All parts and subsystem functions are required to be classified according to their importance in the operation of the vehicle (ie functional importance classification). Table 2 is an example of product function importance division.　　

serial number	system	Functional description	Region
serial number	system	Functional description	I	II	III
1	power system	Start system function	—	—	√
		Engine ignition system function	—	—	√
		High-voltage three-electric system control function	—	—	√
		shift control function	—	—	√
		gearbox function	—	—	√
		PTO control function	—	—	√
		Dynamic stability control function	—	√	—
		Affects PTO sensor function	—	—	√
		Does not affect PTO sensor function	—	√	—
		High voltage charging system function	—	—	√
		Fault indications and messages	—	—	√
		status information display	—	√	—
2	Chassis intelligent driving system	steering system function	—	—	√
		brake system function	—	—	√
		Active safety system functions	—	—	√
		Intelligent driving system function	—	—	√
		Park assist system functions	—	√	—
		Parking brake system function	—	√	—
		Electronic Suspension Function	—	—	√
		Driving recorder function	—	√	—
		sensor function	—	—	√
		Fault indications and messages	—	—	√
		status information display	—	√	—
3	infotainment system	Instrument function	—	—	√
		Radio function	√	—	—
		Streaming function	—	√	—
		navigation function	—	√	—
		Bluetooth phone function	—	√	—
		HMI interactive function	—	—	√
		Voice recognition function	—	√	—
		Face recognition function	—	√	—
		image display stability	—	—	√
		sound stability	—	√	—
4	body control system	Data bus system functions	—	—	√
		diagnostic function	—	√	—
		Vehicle anti-theft system function	—	—	√
		Communication module communication function	—	—	√
		Communication module network interaction function	—	√	—
		Exterior light system function	—	—	√
		Interior light system function	√	—	—
		headlight cleaning function	√	—	—
		Rain sensor function	—	—	√
		Windshield wiper function	—	—	√
		Windshield washer function	√	—	—
		window adjustment function	—	√	—
		Electric sunroof function	—	√	—
		Lock system function	—	—	√
5	Air Conditioning System	air conditioning function	—	—	√
		Air conditioning function stability	—	√	—
		Electric compressor function	—	√	—
		Cooling fan function	—	√	—
		Auxiliary electric heating function	—	√	—
		Windshield defroster system function	—	—	√
		Active air intake grille function	√	—	—
		sensor function	—	√	—
		Air purification and quality monitoring function	√	—	—
6	auxiliary system	Power supply system function	—	—	√
		Charging system function	—	√	—
		Keyless entry and start system functions	—	—	√
		Tire pressure monitoring system function	—	√	—
		seat adjustment function	√	—	—
		Electric mirror function	√	—	—
		tailgate control function	—	√	—
		Sliding door control function	—	√	—
		Horn function	—	√	—
		Pedestrian warning system function	—	√	—
		Passive safety system features	—	—	√

　　Table 2 Example of product function importance classification

　　2.6 Classification of performance

　　Class A: All functions of the tested sample or system operate normally during and after the disturbance, meeting the design requirements;

　　Class B: All functions of the sample or system under test operate normally when disturbed. However, the operation of one or more functions will deviate from the specified tolerance. All functions can automatically return to normal conditions after the disturbance is withdrawn, but the memory function cannot be affected;

　　Class C: One or more functions of the sample or system under test cannot operate normally when disturbed, but can automatically return to normal conditions after the disturbance is removed, but the memory function cannot be affected;

　　Class D: When and after being disturbed, the functions of the equipment and system cannot operate normally, but after the disturbance is removed and reset by the operator/user, it can still operate normally, but the memory function cannot be affected;

　　Class E: Equipment and systems do not function normally during and after the disturbance and cannot be restored to normal condition without repair or replacement of the equipment or system.

　　2.7 Number of samples

　　The tested samples of each test item shall not be less than 2, and each product must pass the tests of all items required in the test plan and meet the requirements.

　　2.8 Test sequence

　　The electrostatic discharge test is performed before other test items. Make sure that the samples tested for other items have passed the ESD test, and all other test items can be carried out in any order. Be aware of possible damage due to electrostatic discharge testing, and it is recommended to prepare spare test samples. All corrective actions due to electrostatic discharge will require retesting.

　　2.9 Application Requirements

　　Table 3 lists all electromagnetic compatibility requirements and the scope of application of electrical and electronic components.

Chapter number			Type of parts Test items		Part/System Type
					Low Voltage Components / Systems																High Voltage Parts / Systems
					pure basic components R/C/D device a		Purely perceptual deviceb		motor c				Active electronic modules d				Radio transceiver parts / systems e				HVDC port f		High voltage AC port g
					P		L		BM		IN		A		AS		WR		WLR		HDC		THIS
interference test
7.1.1			radiation emission （RE）		——		——		√		√		√		√		√		√		√		√
7.1.2.1			Conducted emission- voltage method ( CEV ) h		——		——		√		√		√		√		√		——		——		——
7.1.2.2			Conducted emission- current method （CEC）		——		——		——		√		√		√		√		——		√		√
7.1.2.3			Conducted emission- high voltage side ( CEHV )		——		——		——		——		——		——		——		——		√		√
7.1.3			magnetic field emission （SIMPLE ）		——		——		√		√		——		——		√		√		√		√
7.1.4			Harmonic emission （HE）		——		——		——		——		——		——		——		——		——		√
Transient Disturbance Test
7.2.1	transient conduction shot ( CTE )			——		√		√		√		——		——		——		——		——		——
7.2.2	Voltage fluctuations and flashing ( VF )			——		——		——		——		——		——		——		——		——		√
Anti-interference test
7.3.1	Radiation anti-jamming （RI）			——		——		——		√		√		√		√		√		√		√
7.3.2	RF anti- jamming- Bulk Current Injection ( BCI )			√		——		——		√		√		√		√		——		——		——
7.3.3	Magnetic field anti-interference ( MFI ) i			——		——		√		√		√		√		√		√		——		——
Transient immunity test
7.4.1		Coupling anti-jamming （CIS）			√		——		——		√		√		√		√		——		——		——
7.4.2		Transient conduction resistance Interference (CIP)			√		——		——		√		√		——		√		——		——		——
7.4.3		electrostatic discharge （ESD）			√		——		——		√		√		√		√		√		√		√
7.4.4		electrical fast pulse Group (EFT)			——		——		——		——		——		——		√		——		√		√
7.4.5		Surge (SC)			——		——		——		——		——		——		√		——		√		√
a Pure basic components R/C/D device: Parts consisting only of varistors, capacitors, diodes, LEDs, etc. Purely inductive devices L: solenoid valves/pumps, solenoids, horns, etc. Motor: A motor BM without a control module on the motor body. The motor body contains the motor EM of the electronics control module. d Active electronic modules: A: Parts that include active electronic components, such as: analog amplifier circuits, switching power supplies, microprocessor-based controllers, and displays. AS: A part or module that is powered by another module, usually a sensor that provides a signal to a controller. e Radio transceiver parts/systems (for test methods and requirements, please refer to EN 301 489, EN 55032, EN 55035 and other standards): WR: The radio transceiver part that contains the wiring harness. WLR: Radio transceiver parts without wiring harness (such as remote key, tire pressure monitoring sensor). f High-voltage DC port HDC: related high-voltage DC ports of high-voltage systems/parts, such as power batteries, drive systems, and high-voltage air-conditioning systems. g High-voltage AC port HAC: The relevant high-voltage AC port of the high-voltage system/part, such as the charging system. Applies to low voltage 12V component power supply ports only. Only applicable to systems/parts with built-in magnetically sensitive components. It is only applicable to the component power supply port directly connected to the low-voltage 12V battery.

　　Table 3 Test Requirement Matrix

　　3 Requirements for test items

　　3.1 Radiated emissions (RE)

　　The frequency range of radiated emission measurement is 100kHz~6GHz, and the parameter settings of the test receiver or spectrum analyzer meet the relevant requirements of CISPR 25, and the parameter settings of 0.1MHz~0.15 MHz refer to the requirements of 0.15MHz~30MHz. The test equipment complies with the relevant requirements in CISPR 25. The test method refers to CISPR 25.

　　Test frequency band and test antenna requirements:

　　1) 1 m monopole vertical antenna is used for the frequency range measurement of 100kHz～30MHz;

　　2) 30MHz ~ 200MHz frequency range measurement using biconical antenna;

　　3) 200MHz～1000MHz frequency range measurement using logarithmic periodic antenna;

　　4) 1000 MHz~6000 MHz horn antenna or logarithmic periodic antenna.

　　The radiation disturbance limits of each frequency band need to meet the limit requirements in Table 4, see Figure 2 for the limit requirements.

Limit type	Frequency range (MHz)	Limit A Peak PK dB(μV/m)	Limit B Quasi-peak QP dB(μV/m)	Limit C Average AV dB(μV/m)
continuous limit	0.15~4.77	129~99 129-19.97lg(f/0.15)	——	——
	4.77~15.92	99~68 99-59.22lg(f/4.77)	——	——
	15.92~20	68~66 68-20.18lg(f/15.92)	——	——
	20~30	66~56 66-56.79lg(f/20)	——	——
	30~75	——	56~46 56-25.13*Log(f /30)	46~36 46-25.13*Log(f /30)
	75~400	——	46~57 46+15.13*Log(f /75)	36~47 36+15.13*Log(f /75)
	400~1 000	——	57	47
	1 000~3 000	70	——	50
	3 000~6 000	74	——	54
Subsection limit	0.1~0.15	66	——	——
	0.15~0.3(LW)	66	53	46
	0.52~1.8(MW)	48	35	28
	76~108(VHF)	44	31	twenty four
	170~245	32	——	twenty two
	380~512	44	——	30
	824~960	56	43	36
	1 160~1 300	——	——	19 (9kHz RBW)
	1 447~1 494	40	——	30
	1 555~1 610	——	——	22 (9kHz RBW)
	1 710~2 690	56	——	36
	3 300~3 600	56	——	36
	4 800~5 000	56	——	36
	5 150~5 850	50	——	30
	5 905~5 925	50	——	30
Note 1: f is the measurement frequency (MHz). Note 2: The whole frequency band needs to meet the requirements of limit value A, limit value B and limit value C at the same time. Note 3: 9 kHz bandwidth detector (0.1 MHz ~30 MHz), 120 kHz bandwidth detector (30 MHz ~3 000 MHz), 1MHz bandwidth detector (3 000 MHz ~6 000 MHz). Note 4: 0.1 MHz-3 000 MHz full-band scanning, when the peak value exceeds the quasi-peak limit value, perform quasi-peak scanning in the exceeding standard frequency band, and the limit value requirements of PK, QP and AV must be met at the same time. Note 5: For short-term disturbance sources (such as rearview mirror adjustment motors), the peak limit can be increased by 6 dB with the agreement of SMTC engineering department. Note 6: For ignition coil parts, only continuous limit value requirements need to be met if the EMC performance of the whole vehicle meets the requirements and the SMTC engineering department agrees.

　　Table 4 Requirements for Radiated Emission Limits

　　Figure 2 Radiated emission limits

　　The total length of the test harness shall be 1700mm (+300 mm/-0 mm). The position of the wire harness and the sample to be tested should be fixed, and the radius angle of the wire harness should be between 90° and 135°, as shown in Figure 3. The wiring harness is placed on a 50 mm thick insulating pad on the ground plane. Refer to Figure 4 and Figure 5 for the test layout.

　　Figure 3 Test harness bending radius requirements

　　Figure 4. Example of test setup for radiated emissions - biconical antenna measurements (top view)

　　Figure 5. Example of test setup for radiated emissions - biconical antenna measurements (side view)

illustrate:
1——The sample to be tested	14——Additional shielding box
2 - Ground plane	15——HV power supply or load (the ones placed in ALSE should be shielded)
3——Low relative permittivity material support (εr≤1.4) thickness 50 mm	16 - Power Line Filter
4 - Ground strap	17——Fiber Feedthrough
5——LV wire harness	18 - Wall plate connector
6——HV 线杩（HV+、HV-）HV lines (HV+, HV-)	19 — Incentive and monitoring system
7——LV analog load	20—Measuring equipment
8 —— Impedance matching network (optional)	21 - Good quality coaxial cable (50 Ω), e.g. double shielded
9——LV AN	22 - Optical fiber
10——HV AN	23 - biconical antenna
11——LV power cord	24——RF absorbing material
12——HV power cord	25——50Ω load
13——LV power supply 12V/24V/48V (should be placed on the bench)

　　3.2 Conducted Emissions (CE)

　　3.2.1 Conducted emission-voltage method (CEV)

　　The frequency range of conducted emission measurement is 100kHz~108MHz, and the parameter settings of the test receiver or spectrum analyzer meet the relevant requirements of CISPR 25, and the parameter settings of 0.1MHz~0.15 MHz refer to the requirements of 0.15MHz~30MHz. The test equipment complies with the relevant requirements in CISPR 25. The test method refers to CISPR 25.

　　The test setup is shown in Figure 6.

　　Table 5 and Figure 7 show the limits of the conduction emission voltage method.

illustrate:
1 - power supply	8 - Good quality coaxial cable (50 Ω), e.g. double shielded
2 - Artificial Network	9—Measuring equipment
3——The measured object	10 - shielded room
4 - simulated load	11——50Ω load
5 - Reference ground plane	12 - Wall plate connector
6 - power cord	13——Test harness (not including power cord)
7——Low relative permittivity material support (εr≤1.4) thickness 50 mm

　　Figure 6 Example of test arrangement for conducted emission-voltage method-far-end grounding

Frequency (MHz)	Limit requirement dB(μV)
Frequency (MHz)	the peak	quasi-peak	average value
0.1~0.15	90	——	——
0.15~0.5	90	77	66
0.5~1.8	62	49	42
1.8~76	——	71	60
76~108	44	31	twenty four
Note 1: 0.1 MHz-108 MHz full-band scan, when the peak value exceeds the quasi-peak limit, the quasi-peak scan is performed in the exceeding-standard frequency band, and PK and QP must be satisfied at the same time and AV limit requirements. Note 2: For short-term disturbance sources (such as rearview mirror adjustment motors), the peak limit can be increased by 6 dB with the agreement of SMTC engineering department.

　　Table 5 Conducted emission limits - voltage method

　　Figure 7 Conducted emission limits - voltage method

　　3.2.2 Conducted emission-current method (CEC)

　　Table 6 and Figure 8 show the limits of the conduction emission voltage method.

　　Refer to Figure 9 and Figure 10 for the test layout.

　　All signal and control lines need to be tested.

Frequency (MHz)	Limit requirement dB(μA)
Frequency (MHz)	the peak	quasi-peak	average value
0.1~0.15	70	——	——
0.15~0.5	70	57	50
0.5~1.8	34	twenty one	14
1.8~76	——	51	44
76~108	16	3	-4
Note 1: 0.1 MHz-108 MHz full-band scanning, when the peak value exceeds the quasi-peak limit value, perform quasi-peak value scanning in the exceeding standard frequency band, which must meet the requirements of PK, QP and AV limit values at the same time. Note 2: For short-term disturbance sources (such as rearview mirror adjustment motors), the peak limit can be increased by 6 dB with the agreement of SMTC engineering department.

　　Table 6 Conducted emission limits - current method

　　Figure 8 Conducted emission limits - current method

　　Figure 9 Example of test arrangement for conducted emission-current method (top view)

illustrate:
1——The sample to be tested	14——Additional shielding box
2 - Ground plane	15——HV power supply or load (placed in ALSE should be shielded)
3——Low relative permittivity material support (εr≤1.4) thickness 50 mm (motors can use non-conductive supports)	16 - Power Line Filter
4——Current Probe	17——Fiber Feedthrough
5——LV wire harness	18 - Wall plate connector
6——HV wiring harness (HV+, HV-)	19 — Incentive and monitoring system
7——LV analog load	20—Measuring equipment
8 —— Impedance matching network (optional)	21 - Good quality coaxial cable (50 Ω), e.g. double shielded
9——LV AN	22 - Optical fiber
10——HV AN	23 - ground strap
11——LV power cord	24 - shielded room
12——HV power cord	25——50Ω load
13——LV power supply 12 V/24 V/48 V (should be placed on the bench)

　　Figure 10 Example of test arrangement for conducted emission-current method (side view)

　　3.2.3 Conducted Emission - High Voltage Side (CEHV)

　　Conducted emission measurement frequency range is 150kHz ~ 108MHz, and the test equipment complies with the relevant requirements of ECE R10.

　　Table 7 and Table 8 are the limit values of the high-voltage end of conducted emission.

　　The test setup is shown in Figure 11.

frequency band	Frequency range (MHz)	Limit A Peak dBμV	Limit B Quasi-peak dBμV	Limit C Average dBμV
M1	0.15~0.5	——	66~56 66-19.12lg(f/0.15)	56~46 56-19.12lg(f/0.15)
M2	0.5~5	——	56	46
M3	5~30	——	56~60 56+5.14lg(f/5)	46~50 46+5.14lg(f/5)
M4	30~108	——	60	50

　　Table 7 Conducted Emission Limits - AC High Voltage Terminal

frequency band	Frequency range (MHz)	Limit A Peak dBμV	Limit B Quasi-peak dBμV	Limit C Average dBμV
M1	0.15~0.5	——	79	66
M2	0.5~30	——	79~73 79-3.37lg(f/0.5)	66~60 66-3.37lg(f/0.5)
M3	30~108	——	73	60

　　Table 8 Conducted Emission Limits - DC High Voltage Terminal

　　Figure 11 Conducted Emission-Example of High Voltage Terminal Test Arrangement

1——The sample to be tested	5 - power socket
2——Low relative permittivity material support (εr≤1.4) thickness 50 mm	6 - Receiver
3——Charging cable	7 - Ground Plane
4——AMN(s) or DC charging AN(s) (requires grounding)

　　3.3 Magnetic field emission (MFE)

　　The magnetic field emission measurement frequency range is 10kHz ~ 400kHz, and the test equipment meets the relevant requirements of MIL-STD-461.

　　Table 9 and Figure 12 show the limits of magnetic field emissions.

　　The test setup is shown in Figure 12-a.

Frequency (kHz)	Limit requirement dBpT
0.01～1	162
1～100	162-40lgFreq(kHz)
100～400	82

　　Table 9 Magnetic Field Emission Limits

　　Figure 12 Magnetic field emission limits

　　Figure 12-a Layout of magnetic field emission test

illustrate:
1 - Receiver	7——Power supply
2——Double-layer shielded cable	8 - ground plane
3——The sample to be tested	9——near field magnetic field probe
4—Battery	10——Wire harness under test
5——Artificial Power Network	11 - ground strap
6——Simulated load

　　3.4 Harmonic Emissions (HE)

　　The test equipment meets the relevant requirements of ECE R10, and the odd and even harmonics are measured up to the 40th harmonic.

　　The test setup is shown in Figure 14.

　　Table 10 is the limit value of harmonic emission less than 16A, and Table 11 is the limit value of harmonic emission greater than 16A and less than 75A.

　　Figure 13 Harmonic emission test layout

　　Table 10 ≤16A Harmonic Emission Limits

　　Table 11 >16A and ≤75A harmonic emission limits

　　3.5 Conducted Transient Emissions (CTE)

　　The test equipment complies with the relevant requirements of ISO 7637-1 and ISO 7637-2.

　　During the fast pulse test, the positive transient voltage of the tested sample does not exceed +75V, and the negative transient voltage does not exceed -100V. During the slow pulse test, the positive transient voltage of the tested sample does not exceed +50V, and the negative transient voltage does not exceed - 50V, where the limit is the test value relative to 0V.

　　Figure 14 is a test layout for transient conducted emissions.

　　a) Fast pulse - DUT without built-in switch

　　b) Fast pulse-DUT with built-in switch

　　c) slow pulse

　　Figure 14 Transient emission test layout

illustrate:
1 - Digital Oscilloscope	5 - ground plane
2 - voltage probe	6—battery
3——Artificial network, mechanical/electronic switch	7—Earth wire, length < 100 mm
4——The sample to be tested	8——Parallel resistance Rs=40Ω

　　3.6 Voltage Fluctuation and Flicker (VF)

　　The test equipment complies with the relevant requirements of ECE R10.

　　Figure 15 is a test layout diagram of voltage fluctuation and flicker.

　　Table 12 shows the limits of voltage fluctuation and flicker.

　　Figure 15 Voltage fluctuation and flicker test layout

parameter	Limit requirements
Pst	1.0
Plt	0.65
d(t)	3.3%(500ms)
dc	3.3%
dmax	4%

　　Table 12 Limits of Voltage Fluctuation and Flicker

　　3.7 Radiated Immunity (RI)

　　The test equipment complies with the relevant requirements of ISO 11452-1 and ISO 11452-2. Tests were performed using surrogate methods.

　　For the test with frequency ≤1000MHz, the transmitting antenna is placed directly in front of the center of the tested sample harness (refer to ISO 11452-2). For the test with a frequency ≥1000MHz, the antenna should be moved 750mm along the front edge of the ground plane, and the center of the antenna should face the sample under test instead of the center of the test harness.

　　Figure 16 is a radiation anti-jamming layout diagram.

　　Table 13 is the radiation immunity test requirements.

Frequency (MHz)	Level 1（V/m）	Level 2（V/m）	Modulation
80~1000 a	50	100	CW, AM80 %
800~1 000	50	100	Pulse, ton = 577 µs, T = 4.6 ms
1 000~6 000	50	100	CW, Pulse, ton = 577 µs, T = 4.6 ms
	functional status		——
Region I	A	——
Region II b	A	C
Region III	——	A
a Among them, 80 MHz~400 MHz only need antenna vertical polarization, and the rest of the frequency bands need antenna vertical polarization and horizontal polarization. b Region II functional level Level 1 & Level 2 need to meet the requirements, it is recommended to implement the high level requirements first, if the high level meets the requirements of Class A requirements, low-level requirements may not be implemented.

　　Table 13 Radiation immunity test requirements

　　Figure 16 Layout of radiation immunity test

illustrate:
1——The sample to be tested	8—horn antenna
2——Test Harness	9——Simulation and monitoring equipment
3 - simulated load	10——High-quality double-layer shielded coaxial cable
4——Car battery	11 - bulkhead connector
5 - Artificial Network	12——RF Generator
6 - Ground plane (connected to shielded room wall)	13—radio frequency absorbing material
7——Insulation pad (εr ≤ 1.4)

　　3.8 Radio frequency anti-jamming - large current injection method (BCI)

　　The test equipment complies with the relevant requirements of ISO 11452-1 and ISO 11452-2. The test is performed using a calibrated injection clamp method (alternative method) in accordance with ISO 11452-4.

　　If the free field immunity test of the whole vehicle fails below 200MHz, and the BCI test of the parts fails to reproduce the fault, the retest and troubleshooting can be carried out according to the strip line method of the parts, referring to ISO 11452-5 for details.

　　Figure 17 and Figure 18 are the anti-interference layout diagrams of the large current injection method.

　　Table 14 and Figure 19 show the anti-interference test requirements of the large current injection method.

　　Figure 17 BCI test layout - top view

　　Figure 18 BCI Test Layout - Side View

illustrate:
1——The sample to be tested	8——RF signal generator and power amplifier
2——Test Harness	9 —— Optional current probe
3 - simulated load	10 - injection probe
4——Simulation and monitoring equipment	11 - Ground plane (connected to shielded room wall)
5 - power supply	12——Insulation pad (εr ≤ 1.4)
6 - Artificial Network	13——shielding shell
7 - Optical fiber

Frequency (MHz)	Level 1 (dBuA)	Level 2 (dBuA)	method	Modulation
1~15	86~102 86+13.61*log(f)	90~106 90+13.61*log(f)	DBCIb	CW, AM80 %
15~60	102	106	DBCIb & CBCI	CW, AM80 %
60~400	102~96 102-7.28*log(f/60)	106~100 106-7.28*log(f/60)	CBCI	CW, AM80 %
	functional status		The test wire harness of the sample under test should be placed in the into the clamp.
Region I	A	——
Region II a	A	C
Region III	——	A
a Region II functional level Level 1 & Level 2 need to meet the requirements. It is recommended to implement the higher level requirements first. If the higher level meets the Class A requirements, the lower level requirements do not need to be implemented. b DBCI only performs 150mm and 450mm test points.

　　Table 14 BCI test requirements

　　Figure 19 BCI test requirements

　　3.9 Magnetic field immunity (MFI)

　　The test equipment complies with the relevant requirements of ISO 11452-1 and ISO 11452-8. Including the Helmholtz coil method and the radiation coil method, you can choose one of the two methods, and the dwell time is at least 2s.

　　Table 15 shows the test requirements for magnetic field immunity.

　　Figure 20 and Figure 21 are layout diagrams of magnetic field anti-interference.

Frequency band (Hz)	Test level 1 (A/m)	Test level 2 (A/m)
DC, 16.67 Hz, 50 Hz, 60 Hz	300	1 000
15~1 000	300	1 000
1 000~10 000	300/( ƒ /1 000)2	1,000/( ƒ /1,000)2
10 000~150 000	3	10
	functional status
Region I	A	——
Region II a	A	C
Region III	——	A
a Region II functional level Level 1 & Level 2 need to meet the requirements. It is recommended to implement the higher level requirements first. If the higher level meets the Class A requirements, the lower level requirements do not need to be implemented.

　　Table 15 Magnetic field immunity test requirements

　　Figure 20 Helmholtz coil method test layout

　　Figure 21 Radiation coil method test layout

illustrate:
1——The sample to be tested	7—Battery
2—radiating coil	8 - sensor
3——Current Probe	9——Executive agency
4 - Signal Source and Amplifier	10 - insulating pad
5 - Oscilloscope	11 - ground plane
6 - power supply

　　3.10 Coupling/Inductive Conducted Immunity (CIS)

　　The test equipment complies with the relevant requirements of ISO 7637-1 and ISO 7637-3. There are three types of tests: capacitive coupling clamp (CCC), direct capacitor coupling (DCC) and inductive coupling clamp (ICC). Among them, direct capacitor coupling (DCC) and inductive coupling clamp (ICC) are only applicable to sensors. device.

　　Table 16 shows the coupling/inductive conduction anti-interference test requirements.

　　Figure 22, Figure 23, and Figure 24 are the layout diagrams of coupling/inductive conduction anti-interference.

test pulse	Test level 3	Minimum test time	Test Methods	Pulse period
test pulse	Test level 3	Minimum test time	Test Methods	the smallest	maximum.
3a	-60 V	20 min	CCC	90 ms	110 ms
3b	+40 V	20 min	CCC	90 ms	110 ms
2-positive 1	+30 V	5 min	DCC2	0.5 s	5 s
2 - minus 1	-30 V	5 min	DCC2	0.5 s	5 s
2-positive 1	+6 V	5 min	ICC	0.5 s	5 s
2 - minus 1	-6 V	5 min	ICC	0.5 s	5 s
Note 1: Pulse 2-positive and negative is only applicable to sensor components. Note 2: The parameter of DCC coupling capacitor is 0.1μF, and the parameter of coupling capacitor for twisted pair such as CAN line is two 470pF connected to two signal lines respectively. Note 3: For CCC and DCC, the test level Us is the open circuit voltage of the pulse generator; for ICC, the test level Us is the output voltage measured by the calibration test arrangement.

　　Table 16 Coupling/inductive conduction anti-interference test requirements

　　Figure 22 Capacitive coupling clamp method test layout - CCC method

illustrate:
1 - insulating pad	8 - Oscilloscope
2——The sample to be tested	9 - 50 Ω attenuator
3——Test harness insulation pad	10——Capacitive coupling clamp
4 - Peripherals	11 - Test pulse generator
5 - ground plane	12——Tested harness
6 - power supply	13——Non-tested harness
7—Battery

　Figure 23 Test layout of direct capacitor coupling method - DCC method

illustrate:
1 - Test Pulse Generator	5——I/O line under test
2——The sample to be tested	6 - power supply
3——Connect the wiring harness 4 - Ground plane	7 - simulated load C - high voltage (200 V) ceramic capacitor

Figure 24 Inductive coupling clamp method test layout - ICC method

illustrate:

1——The sample to be tested

2 - Test Pulse Generator

3—Coupling clamp (150 mm from the sample to be tested)

4 - Peripherals

5——Test harness (length not exceeding 2 m)

6 - power cord

7——Insulation pad (50mm±10mm)

8 - ground plane

9—battery

10——DC power supply

11 - 50 Ω coaxial cable (up to 0.5 m)

　　3.11 Transient Conduction Immunity (CIP)

　　The test equipment complies with the relevant requirements of ISO 7637-1, ISO 7637-2 and ISO 16750-2.

　　Table 17 shows the test requirements for transient conduction immunity.

　　Figure 25 is a transient conduction anti-interference layout diagram.

Pulse number	Pulse parameter 1	Test pulse requirements 3	functional status
1	Us=-112 V	500 pulse	The functional state should meet the requirements of Class C, and the memory function It should meet the requirements of Class A.
2a	Us=+75 V	500 pulse	Class A
2b	Us=+10 V	10 pulse	The functional state should meet the requirements of Class C, and the memory function It should meet the requirements of Class A.
3a	Us=-165 V	10 min	Class A
3b	Us=+112 V	10 min	Class A
42	Us=+6 V UA=+6.5V	3 test cycles	Memory functions and functions related to vehicle start-up meet Class A, other functions meet Class C.
5a2	Us=+87 V	10 pulses, 1 minute apart	Class A
5b2	Us=+34 V, td(5a)=400 ms, Ri =2 Ω	10 pulses, 1 minute apart	Class C
Note 1: The unspecified test parameters are carried out according to the requirements of ISO 7637-2 & ISO 16750, where the pulse 5 test level Us is the peak voltage. Note 2: If centralized load dump protection is used, pulse 5a is not required, only pulse 5b is applied. Pulse 4 and 5 are not required for electronic and electrical systems and parts that are only used in new energy vehicles that contain DC/DC parts. Note 3: The pulse interval time of some waveforms can be executed with reference to the system power-down recovery time in the test plan.

　　Table 17 Transient conduction immunity test requirements

　　Figure 25 CIP test layout

illustrate:

1 - Oscilloscope or equivalent

2 - Voltage probe not connected

3——Test pulse generator

4——The measured object

5 - ground plane

6——DC power supply grounding connection (for test pulse 3, up to 100mm)

7 - Dummy load (connected to ground plane if required)

8——Connecting cables (keep away from DUT power lines during the test to avoid coupling)

9——Simulated load grounding (if required)

　　3.12 Electrostatic Discharge (ESD)

　　The test equipment complies with the relevant requirements of ISO 10605. The test facility should be placed in an environment with a relative humidity of 20% to 40% (20°C and 30% relative humidity are preferred).

　　Table 18 and Table 19 are the electrostatic discharge test requirements.

　　Figure 26, Figure 27, and Figure 28 are the layout diagrams of the electrostatic discharge test.

discharge type	test level	mannequin	Discharge times and recovery time at discharge point	discharge point	functional requirements
contact discharge	±4 kV ±6 kV	330 Ω 150 pF	3+&3-; 3 s	Each Pin of the connector	After the test, the power-on function status should meet the requirements of Class C.
contact discharge	±6 kV ±8 kV	330 Ω 150 pF	10+&10-; 3 s	Part exposed surfaces and crevices
air discharge	±8 kV ±15 kV	330 Ω 150 pF	10+&10-; 3 s	Part exposed surfaces and crevices

　　Table 18 Handheld electrostatic discharge parameters (non-operating mode)

discharge type		test level	mannequin	discharge point discharge times number and recovery time	discharge point	functional requirements
discharge type		test level	mannequin	discharge point discharge times number and recovery time	discharge point	Region I	Region II	Region III
direct discharge	contact discharge	±6 kV	330 Ω 330 pF	10+&10-; 3 s	All operations put Hands, keys, switches, and all accessible surfaces	A	A	A
		±8 kV	330 Ω 330 pF	10+&10-; 3 s		C	A	A
		±8 kV	330 Ω 330 pF	10+&10-; 3 s	I/O for connecting switches port, CAN communication port, USB interfaceb	C	C	A
	air discharge	±8 kV	330 Ω 330 pF	10+&10-; 3 s	All operations put Hands, keys, switches, and all accessible surfaces	A	A	A
		±15 kV	330 Ω 330 pF	10+&10-; 3 s		C	A	A
		±25a kV	330 Ω 150 pF	3+&3-; 3 s	Approachable zero outside the car Part surface, refer to the test plan for details	C	C	C
indirect discharge	contact discharge	±8 kV	330 Ω 330 pF	10+&10-; 3 s	Discharge for three discharge islands	C	A	A
		±15 kV	330 Ω 330 pF	10+&10-; 3 s		C	C	A
		±20 kV	330 Ω 330 pF	10+&10-; 3 s		——	——	C
a Requirements limited to devices that are directly accessible from the outside of the vehicle without touching any part of the vehicle (eg door lock switches, headlight switches, instrumentation). b Test at the end of the standard wire harness length. For the communication bus test, it is necessary to add an isolator between the DUT and the test auxiliary instrument. The function state of the USB interface shall be subject to the function status of re-inserting the USB disk after the test.

　　Table 19 Working electrostatic discharge parameters (working mode)

　　Figure 26 Example of electrostatic discharge (non-operating mode)

illustrate:
1——The sample to be tested	5——horizontal coupling plate
2——Electrostatic discharge generator	6 - grounding point
3——Electrostatic discharge generator main equipment	7 —— 2×470 kΩ grounding resistance
4——Non-conductive test table	8 - Pad a
a : It should be made (such as polyethylene material ) , with a relative dielectric constant between 1 and 5 . The thickness of the insulating mat is 2 mm to 3 mm , and each side thereof is at least 20 mm larger than the size of the test arrangement . It should be ensured that the insulating pad will not be broken down when the discharge voltage is 25 kV . The surface resistivity of the material should be 10 7 Ω / m 2 to 10 9 Ω / m 2 .

Figure 27 Direct discharge (working mode)

illustrate:
1 - Field coupling plate	9 - Artificial Network
2 - field coupling band	10—Battery and supporting equipment ground reference point
3 - discharge island	11——The proximal end of the sample under test is grounded
4——Test sample and wire harness isolation board	12 - Coupling plate, ESD generator and safety ground reference point
5——The sample to be tested (if the size is too large, it can be directly placed on the horizontal coupling plate)	13——2×470 kΩ safety grounding high voltage resistance
6——Tested sample wire harness	14——horizontal coupling plate
7—Battery	15 - ESD generator
8 - Peripheral support equipment

Figure 28 Indirect discharge (working mode)

illustrate:
1 - Field coupling plate	9 - Artificial Network
2 - field coupling band	10—Battery and supporting equipment ground reference point
3 - discharge area	11——The proximal end of the sample under test is grounded
4——Test sample and wire harness isolation board	12 - Coupling plate, ESD generator and safety ground reference point
5——The sample to be tested (if the size is too large, it can be directly placed on the horizontal coupling plate)	13——2×470 kΩ safety grounding high voltage resistance
6——Tested sample wire harness	14——horizontal coupling plate
7—Battery	15 - ESD generator
8 - Peripheral support equipment

　　3.13 Electrical Fast Burst (EFT)

　　The test equipment complies with the relevant requirements of ECE R10.

　　Table 20 is the EFT test requirements.

　　Figure 29 is a diagram of the EFT test layout.

power port		signal port
Peak voltage kV	Repetition rate kHz	Peak voltage kV	Repetition rate kHz
2	5 or 100	1	5 or 100

　　Table 20 Electrical fast burst test requirements

　　Figure 29 Example of electrical fast burst test arrangement

　　3.14 Surge (SC)

　　The test equipment complies with the relevant requirements of ECE R10.

　　Table 21 is the surge test requirements.

　　Figure 30 is a diagram of the surge test layout.

	Line-line kV ±10%	Line-ground kV ±10%
test level	1	2

　　Table 21 Surge test requirements

　　Figure 30 Example of a surge test arrangement

　　4 Epilogue

　　SMTC 3 800 006 (V6) Electromagnetic Compatibility Test Specification for Electronic and Electrical Parts System, still refer to CISPR 25, ECE R10, MIL-STD-461, ISO7637-1/2/3, ISO11452-1/2/4/8, ISO16750- 2. Standards such as ISO10605 have no special requirements except that some test items (such as radiated emission RE) wiring harness layout and test frequency range are inconsistent with the reference standards.

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